Hybrid grain-continuum model for thermo-mechanical stresses in polycrystalline Cu 3D IC vias

被引：1
|
作者：
Bloomfield, M. O. [1 ,2 ]
Bentz, D. N. [1 ]
Sukharev, V. [3 ]
Cale, T. S. [1 ,2 ]
机构：
[1] Rensselaer Polytech Inst, Troy, NY 12180 USA
[2] Proc Evolut, Watervliet, NY 12189 USA
[3] Ponte Solut, Mountain View, CA 94040 USA
来源：
2007 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM PROCEEDINGS - 45TH ANNUAL | 2007年
关键词：
D O I：
10.1109/RELPHY.2007.369992
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
We introduce an approach to compute stresses in structures in which grain structures are important. The approach is a hybrid of continuum representations and 3D 'grain-continuum' (GC) models; i.e., models in which grain boundaries are represented and tracked. Stresses due to temperature changes in 3D IC vias are used as to demonstrate our approach. We focus on determining how large the GC region needs to be; that is, how much the computations can be simplified.
引用
收藏
页码：644 / +
页数：2
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