A Signal Conditioner for High-Frequency Inductive Position Sensors

被引：4
|
作者：
Rahal, Mohamad [1 ]
Demosthenous, Andreas [1 ]
Jiang, Dai [1 ]
Pal, Dipankar [2 ]
机构：
[1] UCL, Dept Elect & Elect Engn, London WC1E 7JE, England
[2] Birla Inst Technol, Ranchi 835215, Bihar, India
来源：
2008 INTERNATIONAL CONFERENCE ON MICROELECTRONICS | 2008年
关键词：
D O I：
10.1109/ICM.2008.5393822
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The use of integrated circuit techniques in position sensing applications can offer significant advantages over discrete component solutions, such as miniaturization, reduced cost, increased reliability and enhanced sensitivity. We realized a signal conditioner that includes an application specific integrated circuit (ASIC) and an external microcontroller for readout and control of non-contact high-frequency inductive position sensors. Both the system architecture and details on the key blocks are described. The ASIC was designed in a 0.6-mu m CMOS process technology and preliminary measured results are presented. The signal conditioner architecture is universal and can be used for other sensor types such as LVDTs.
引用
收藏
页码：118 / +
页数：2
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