The influence of adhesive bondline thickness imperfections on stresses in composite joints

被引:11
|
作者
Kim, H [1 ]
机构
[1] Purdue Univ, Sch Aeronaut & Astronaut, W Lafayette, IN 47907 USA
来源
JOURNAL OF ADHESION | 2003年 / 79卷 / 07期
关键词
stress analysis; varying bondline; thickness defect; composite bonding; joint design;
D O I
10.1080/00218460309578
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Adhesively-bonded joints can have spatial variations in bondline thickness with respect to their overlap length. Assumptions pertaining to shear-lag and adherend transverse shear deformation are used to compose a governing differential equation that permits any mathematical function to be used for representing the variation in bondline thickness, t(a) (x). Finite Difference solution techniques are employed to solve this equation, and it is shown by a series of case study example calculations that the adhesive shear stress changes significantly for deviations about a baseline, uniform thickness, configuration. It is also shown that for cases when the gradient in bondline thickness is small, simple closed-form solutions developed strictly for uniform thickness joints can provide reasonable accuracy. Numerical results are summarized as "stress concentration factor" curves, allowing quick estimation of the upper and lower bounds of normalized peak shear stress in joints having varying degrees of thickness imperfection.
引用
收藏
页码:621 / 642
页数:22
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