The finite element model (FEM) analysis of thermal failure in connector

被引：7
|
作者：
Wang, Xin [1 ]
Xu, Liangjun [1 ]
机构：
[1] Beijing Univ Posts & Telecommun, Res Lab Elect Contacts, Beijing 100088, Peoples R China
来源：
Proceedings of the 2nd International Conference on Reliability of Electrical Products and Electrical Contacts | 2007年
关键词：
FEA connector stress relaxation;
D O I：
10.1145/1216295.1216338
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thermal analysis and thermal diagnose is important for small power connector especially in electronic devices since its structure is usually compactly. In this paper thermal behavior of small power connector was investigated. It was found that the contact resistance increased due to the Joule heating, and increased contact resistance produced more Joule heating, this mutual action leads connector to lose efficacy. The thermal distribution in the connector was analyzed using FEM. And mechanism of failure was discussed. It provides structure improving basis. The conclusion was verified by experimental results.
引用
收藏
页码：235 / 240
页数：6
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