Effect of Hole-Injection on Leakage Degradation in a p-GaN Gate AlGaN/GaN Power Transistor

被引:18
|
作者
Tang, Xi [1 ,2 ]
Li, Baikui [1 ]
Moghadam, Hamid Amini [2 ]
Tanner, Philip [2 ]
Han, Jisheng [2 ]
Dimitrijev, Sima [2 ]
机构
[1] Shenzhen Univ, Coll Optoelect Engn, Shenzhen 518060, Peoples R China
[2] Griffith Univ, Queensland Micro & Nanotechnol Ctr, Nathan, Qld 4111, Australia
基金
中国国家自然科学基金;
关键词
p-GaN gate AlGaN/GaN transistors; leakage current degradation; hole injection; persistent photoconductivity; N-TYPE GAN; PERSISTENT PHOTOCONDUCTIVITY; DEVICES; HEMTS; MODEL;
D O I
10.1109/LED.2018.2849398
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The gate structure of a p-(Al) GaN gate AlGaN/GaN high electron mobility transistor (HEMT) is a direct bandgap hetero-PN junction, which emits light under forward bias above the threshold voltage. This internal light emission induces persistent photoconductivity (PPC) of the GaN channel/buffer layer, leading to the increase in OFF-state leakage current. In this letter, we studied the OFF-state leakage degradation induced by ON-state gate drive of a p-GaN gate HEMT. Two self-limiting functions are discovered: 1) saturation of the increment of leakage current under continuous pulse operations and 2) dramatically enhanced recovery speed of the internal light-emission-induced PPC effect at elevated temperatures. This letter indicates the robustnessofp-(Al) GaN gate HEMTs in switching applications in spite of the seemingly inevitable leakage current degradation.
引用
收藏
页码:1203 / 1206
页数:4
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