High frequency interconnections and crosstalk on MCM structures

被引:0
|
作者
Free, CE [1 ]
Tang, KP [1 ]
Li, D [1 ]
Pitt, KEG [1 ]
Barnwell, P [1 ]
机构
[1] MIDDLESEX POLYTECH,SCH ELECT ENGN,LONDON N11 2NQ,ENGLAND
关键词
MCM; crosstalk; microwave; interconnection;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:522 / 525
页数:4
相关论文
共 50 条
  • [1] Frequency-dependent crosstalk simulation for on-chip interconnections
    Deutsch, A
    Smith, HH
    Surovic, CW
    Kopcsay, GV
    Webber, DA
    Coteus, PW
    Katopis, GA
    Becker, WD
    Dansky, AH
    Sai-Halasz, GA
    Restle, PJ
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (03): : 292 - 308
  • [2] Frequency-dependent crosstalk modeling for on-chip interconnections
    Deutsch, A
    Smith, H
    Surovic, CW
    Kopcsay, GV
    Webber, DA
    Katopis, GA
    Becker, WD
    Coteus, PW
    Dansky, AH
    Sai-Halasz, GA
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1998, : 35 - 38
  • [3] An efficient crosstalk parameter extraction of embedded microstrip structures on high-speed MCM
    Sung, M
    Ryu, W
    Kim, H
    Kim, J
    Kim, J
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 475 - 479
  • [4] Efficient crosstalk parameter extraction of embedded microstrip structures on high-speed MCM
    Sung, Myunghee
    Ryu, Woonghwan
    Kim, Hyungsoo
    Kim, Jonghoon
    Kim, Joungho
    [J]. Proceedings - Electronic Components and Technology Conference, 1999, : 475 - 479
  • [5] Crosstalk Analysis and Optimization of High-Speed Interconnections
    Wang, Haidong
    Song, Jian
    Liu, Fengman
    Xiang, Haifei
    Gao, Wei
    Wan, Lixi
    [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 964 - 967
  • [6] Crosstalk in VLSI interconnections
    Vittal, A
    Chen, LH
    Marek-Sadowska, M
    Wang, KP
    Yang, S
    [J]. IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1999, 18 (12) : 1817 - 1824
  • [7] Simulation and optimization of MCM interconnections
    Feng, WS
    Shing, TC
    Chen, MC
    [J]. 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 178 - 183
  • [8] Frequency dependence in high speed interconnections
    Kergonou, G
    Drissi, M
    Zak, T
    Zavier, C
    [J]. 2001 IEEE EMC INTERNATIONAL SYMPOSIUM, VOLS 1 AND 2, 2001, : 632 - 634
  • [9] A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains
    Salik, R
    Tao, JW
    Angenieux, G
    Flechet, B
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01): : 74 - 81
  • [10] Crosstalk noise in high density and high speed interconnections due to inductive coupling
    Mido, T
    Asada, K
    [J]. PROCEEDINGS OF THE ASP-DAC '97 - ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 1997, 1996, : 215 - 220