共 50 条
- [31] Evaluation of the effects of the metal foams geometrical features on thermal and fluid-dynamical behavior in forced convection INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2020, 111 (3-4): : 1157 - 1172
- [32] Evaluation of the effects of the metal foams geometrical features on thermal and fluid-dynamical behavior in forced convection The International Journal of Advanced Manufacturing Technology, 2020, 111 : 1157 - 1172
- [33] Using experimental analysis to evaluate the influence of Printed Circuit Board construction on the thermal performance of four package types in both natural and forced convection ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL 2, PROCEEDINGS, 2000, : 213 - 225
- [34] Using experimental analysis to evaluate the influence of printed circuit board construction on the thermal performance of four package types in both natural and forced convection Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, 2000, 2 : 213 - 225
- [35] Experimental Analysis of Electro-Thermal Contact Resistance of Al and Cu Surfaces 2018 5TH IEEE UTTAR PRADESH SECTION INTERNATIONAL CONFERENCE ON ELECTRICAL, ELECTRONICS AND COMPUTER ENGINEERING (UPCON), 2018, : 139 - 145
- [36] Experimental investigation of contact resistance across pressed lead and aluminum contact in vacuum American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD, 2000, 366 : 155 - 162
- [37] Experimental investigations on thermal, thermocapillary and forced convection in Czochralski crystal growth configuration COMPUTATIONAL METHODS AND EXPERIMENTAL MEASUREMENTS X, 2001, 3 : 627 - 636