Early probabilistic noise estimation for capacitively coupled interconnects

被引:6
|
作者
Becer, MR [1 ]
Blaauw, D
Panda, R
Hajj, IN
机构
[1] Motorola Inc, Adv Tools Grp, Austin, TX 78729 USA
[2] Univ Illinois, Coordinated Sci Lab, Urbana, IL 61801 USA
[3] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA
关键词
congestion; crosstalk noise; global routing; probabilistic extraction;
D O I
10.1109/TCAD.2002.807892
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
One of the critical challenges in today's high-performance IC design is to take noise into account as early as possible in the design cycle. Current noise analysis tools are effective at analyzing and identifying noise in the postroute design stage when detailed parasitic information is available. However, noise problems identified at this stage of design cycle are very difficult to correct due to the limited flexibility in design and may cause additional iterations of routing and placement which adds costly delays in its time to market. In this paper, we introduce a probabilistic preroute noise analysis approach to identify postroute noise failures before the actual detailed route is completed. We introduce new methods to estimate the RC characteristics of victim and aggressor lines, their coupling capacitances, and the aggressor transition times before routing is performed. The approach is based on congestion information obtained from a global router. Since the exact location and relative position of wires in the design are not yet available, we propose a novel probabilistic method for capacitance extraction. We present results on two high-performance microprocessors in 0.18 mum technology that demonstrate the effectiveness of the proposed approach.
引用
收藏
页码:337 / 345
页数:9
相关论文
共 50 条
  • [1] Efficient coupled noise estimation for on-chip interconnects
    Devgan, A
    [J]. 1997 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN - DIGEST OF TECHNICAL PAPERS, 1997, : 147 - 151
  • [2] Temperature-dependent analysis of Crosstalk noise in Capacitively Coupled Interconnects for Mixed Carbon Nanotubes Bundle
    Sharma, Manvi
    Rai, Mayank Kumar
    Khanna, Rajesh
    [J]. PROCEEDINGS OF THE 2019 IEEE REGION 10 CONFERENCE (TENCON 2019): TECHNOLOGY, KNOWLEDGE, AND SOCIETY, 2019, : 2549 - 2553
  • [3] A Capacitively Coupled Noise Circulating VCO
    Ji, Xincun
    Wang, Youhua
    Xia, Xiaojuan
    Guo, Yufeng
    [J]. IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2021, 31 (10) : 1127 - 1129
  • [4] On dynamic delay and repeater insertion in distributed capacitively coupled interconnects
    Pamunuwa, D
    Tenhunen, H
    [J]. PROCEEDING OF THE 2002 3RD INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, 2002, : 240 - 245
  • [5] Phase noise in capacitively coupled micromechanical oscillators
    Kaajakari, V
    Koskinen, JK
    Mattila, T
    [J]. IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 2005, 52 (12) : 2322 - 2331
  • [6] COUPLED NOISE PREDICTORS FOR LOSSY INTERCONNECTS
    KATOPIS, GA
    SMITH, HH
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1994, 17 (04): : 520 - 524
  • [7] Crosstalk analysis for a CMOS gate driven inductively and capacitively coupled interconnects
    Kaushik, B. K.
    Sarkar, S.
    [J]. MICROELECTRONICS JOURNAL, 2008, 39 (12) : 1834 - 1842
  • [8] A statistical approach to derive an electrical port model of capacitively coupled interconnects
    Maffezzoni, P
    Brambilla, A
    [J]. IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2004, 51 (04) : 797 - 807
  • [9] Repeater insertion in crosstalk-aware inductively and capacitively coupled interconnects
    Kaushik, Brajesh Kumar
    Agarwal, Rajendra P.
    Sarkar, Sankar
    Joshi, Ramesh C.
    Chauhan, D. S.
    [J]. INTERNATIONAL JOURNAL OF CIRCUIT THEORY AND APPLICATIONS, 2011, 39 (06) : 629 - 647
  • [10] Numerical Solution for Crosstalk Noise of Coupled Interconnects
    Wang Zong-yue
    Chen Shao-chang
    Wu Hao
    [J]. PROCEEDINGS OF THE 14TH YOUTH CONFERENCE ON COMMUNICATION, 2009, : 145 - +