Reversal of forward voltage drift in 4H-SiC p-i-n diodes via low temperature annealing

被引:40
|
作者
Caldwell, Joshua D. [1 ]
Stahlbush, Robert E. [1 ]
Hobart, Karl D. [1 ]
Glembocki, Orest J. [1 ]
Liu, Kendrick X. [1 ]
机构
[1] USN, Res Lab, Washington, DC 20375 USA
关键词
D O I
10.1063/1.2719650
中图分类号
O59 [应用物理学];
学科分类号
摘要
Recent reports have shown that Shockley stacking fault (SSF) growth in 4H-SiC may be reversed via low temperature (210-600 degrees C) annealing. It is not clear if the associated drift in the forward voltage drop (V-f) is also reversed. Here we show that annealing of SSFs causes the complete and repeatable recovery of V-f. Furthermore, by looking at the time-dependent recovery of V-f during both the current stressing and thermal annealing of a single diode, we ascertain that the mechanisms for these two processes are different. (c) 2007 American Institute of Physics.
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页数:3
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