Evaluation of 3D Plus packaging test structures for NASA Goddard Space Flight Center

被引：0

作者：

Plante, J ^{[1
]}

Shaw, H ^{[1
]}

机构：

[1] Dynam Range Corp, Lanham, MD 20706 USA

来源：

PROCEEDINGS OF THE EUROPEAN SPACE COMPONENTS CONFERENCE - ESCCON 2002 | 2002年 / 507卷

关键词：

D O I：

暂无

中图分类号：

V [航空、航天];

学科分类号：

08 ; 0825 ;

摘要：

Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D Plus Electronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.

引用

页码：213 / 219

页数：7

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