Electroluminescence of strained SiGe/Si selectively grown above the critical thickness for plastic relaxation

Electroluminescence of strained Si0.80Ge0.20Si(001) pin diodes has been investigated experimentally and by quantitative modeling. The key aspect of this investigation was that by selective epitaxial growth the experimental critical thickness for plastic relaxation (80 nm at T-epi=700 degrees C and large areas) could be increased in finite pads. SiGe layers with thickness of 60, 72 or 370 nm have been grown within the intrinsic i region of pin structures. Samples free of misfit dislocations revealed electroluminescence with the SiGe no-phonon peak and its transversal optical-phonon replica corresponding to interband transitions. It was found that by increasing the thickness of the SiGe layer the drop in the electroluminescence with increasing temperature could be shifted to higher temperature, so that for the 370 nm thick SiGe sample the emission was observed to persist still at 300 K. Modeling based on drift-diffusion and carrier recombination equations was used to simulate the current-voltage characteristics of the pin diodes and their band gap electroluminescence. It was found that the modeling results can account for the temperature and thickness dependence of the electroluminescence. Hole and electron Shockley-Read-Hall recombination times could be evaluated. (C) 1998 American Institute of Physics.