Texture development in drawing copper wire

被引：0

作者：

Keuerleber, J ^{[1
]}

Lehnert, W

机构：

[1] V&M Deutschland GmbH, Dusseldorf, Germany

[2] Tech Univ Bergakad, Freiberg, Germany

来源：

METALL | 2003年 / 57卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

引用

页码：209 / 214

页数：6

共 50 条

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不详
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[J]. INTERNATIONAL CONFERENCE ON ADVANCES IN MATERIALS AND PROCESSING TECHNOLOGIES, PTS ONE AND TWO, 2010, 1315 : 524 - +
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[48] INFLUENCE OF DIE PROFILE AND LUBRICANT ON DRAWING LOAD FOR COPPER WIRE
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[J]. WIRE, 1967, (92): : 272 - &
[49] The effect of drawing temperature on the properties and annealing response of copper wire
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[J]. 2002, Wire Association International Inc. (35):
[50] VOID GROWTH DURING WIRE DRAWING AND TENSILE TESTING OF COPPER
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[J]. SCANDINAVIAN JOURNAL OF METALLURGY, 1980, 9 (06) : 267 - 272

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