Lifetime prediction for advanced packaging based on physics of failure approaches on a micro and nano-scale

被引：0
|
作者：
Wunderle, B.
Dudek, R.
Vogel, D.
Michel, B.
机构：
来源：
IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces | 2006年
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T [工业技术];
学科分类号：
08 ;
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页码：12 / 12
页数：1
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