Highly Efficient and Accurate Package Electrical Modeling Automation

被引：0

作者：

Chiu, Po-Wei ^{[1
]}

Lin, Chun-Hung ^{[1
]}

Shi, Hong ^{[2
]}

机构：

[1] Xilinx Inc, 18F-3,27 Guanxin Rd, Hsinchu 300, Taiwan

[2] Xilinx Inc, 2100 Log Dr, San Jose, CA 95124 USA

来源：

PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2016年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In recent years, the requirement of high-end electronic product is higher signal speed, storage capacity and lower power, the bandwidth of package physical design becomes more critical, such as layer count reduction, package routing density. Therefore, there are many electrical validations in a package design, including PDN (Power Distribution Network) and SSN (Simultaneous Switching Noise). In order to control the accuracy and consistency of the electrical models, and shorten engineering time in the modeling cycle time, we develop a tool, XPAE (Xilinx PowerSI Automated Extraction), for package electrical model auto-extraction based on Cadence PowerSI.

引用

页码：289 / 291

页数：3

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