Highly Efficient and Accurate Package Electrical Modeling Automation

被引:0
|
作者
Chiu, Po-Wei [1 ]
Lin, Chun-Hung [1 ]
Shi, Hong [2 ]
机构
[1] Xilinx Inc, 18F-3,27 Guanxin Rd, Hsinchu 300, Taiwan
[2] Xilinx Inc, 2100 Log Dr, San Jose, CA 95124 USA
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In recent years, the requirement of high-end electronic product is higher signal speed, storage capacity and lower power, the bandwidth of package physical design becomes more critical, such as layer count reduction, package routing density. Therefore, there are many electrical validations in a package design, including PDN (Power Distribution Network) and SSN (Simultaneous Switching Noise). In order to control the accuracy and consistency of the electrical models, and shorten engineering time in the modeling cycle time, we develop a tool, XPAE (Xilinx PowerSI Automated Extraction), for package electrical model auto-extraction based on Cadence PowerSI.
引用
收藏
页码:289 / 291
页数:3
相关论文
共 50 条
  • [1] Highly efficient modeling automation for electronic package thermal analysis
    Zhang, Yuan Xiang
    Liang, Lihua
    Xia, Yangjian
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 1931 - +
  • [2] Application and Integration of Automation-Based Tools for Efficient and Accurate Modeling of Transmission System Protection
    Li, Daixi
    Chang, Tim
    Alaeddini, Saman
    Wen, Guanhua
    Dong, Xinyang
    Bolton, Chris
    Mirza, Ahsan
    Feathers, Aaron
    James, Robbie
    Reindel, Andrew
    Miller, Michael T. Jr Jr
    Tucker, Jacob
    Bauer, Jessie
    2021 74TH CONFERENCE FOR PROTECTIVE RELAY ENGINEERS (CPRE), 2021,
  • [3] GPUMD: A package for constructing accurate machine-learned potentials and performing highly efficient atomistic simulations
    Fan, Zheyong
    Wang, Yanzhou
    Ying, Penghua
    Song, Keke
    Wang, Junjie
    Wang, Yong
    Zeng, Zezhu
    Xu, Ke
    Lindgren, Eric
    Magnus Rahm, J.
    J. Gabourie, Alexander
    Liu, Jiahui
    Dong, Haikuan
    Wu, Jianyang
    Chen, Yue
    Zhong, Zheng
    Sun, Jian
    Erhart, Paul
    Su, Yanjing
    Ala-Nissila, Tapio
    JOURNAL OF CHEMICAL PHYSICS, 2022, 157 (11):
  • [4] Highly efficient modeling and optimization of neural fiber responses to electrical stimulation
    Hussain, Minhaj A.
    Grill, Warren M.
    Pelot, Nicole A.
    NATURE COMMUNICATIONS, 2024, 15 (01)
  • [5] Electrical package and interconnect modeling and analysis - Foreword
    Segelken, JM
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (01): : 2 - 2
  • [6] Optimizing the package design with electrical modeling and simulation
    Qi, Q
    Quint, D
    Frank, M
    Michalka, T
    Bois, K
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 111 - 117
  • [7] Electrical Modeling of Through Silicon and Package Vias
    Bandyopadhyay, Tapobrata
    Chatterjee, Ritwik
    Chung, Daehyun
    Swaminathan, Madhavan
    Tummala, Rao
    2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION, 2009, : 330 - 337
  • [8] New Simulation Procedure for Accurate Package Modeling Considering Chip-Package Interaction
    Seler, E.
    Wojnowski, M.
    Weigel, R.
    Hagelauer, A.
    2013 IEEE 22ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS (EPEPS), 2013, : 43 - 46
  • [9] Accurate package modeling based on S-parameter measurements
    Lin, FJ
    Iyer, MK
    Ma, HN
    Tan, KS
    Kasashima, M
    Shibata, J
    Nakamura, H
    ARFTG 49TH CONFERENCE: (CHARACTERIZATION OF BROADBAND TELECOMMUNICATIONS COMPONENTS SYSTEMS), 1997, : 191 - 200
  • [10] Accurate Modeling Method of LGA Package for High Power Application
    Tsai, Cheng-Yu
    Kuo, Hung-Chun
    Chu, Fu-Chen
    Wang, Chen-Chao
    2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 278 - 281