Low temperature direct bonding comparison

被引：0
|
作者：
Fournel, F. [1 ]
Larrey, V. [1 ]
Morales, C. [1 ]
Bridoux, C. [1 ]
Moriceau, H. [1 ]
Rieutord, F. [1 ,2 ,3 ]
机构：
[1] Univ Grenoble Alpes, F-38000 Grenoble, France
[2] CEA Grenoble, LETI, MINATEC Campus, F-38054 Grenoble, France
[3] CEA Grenoble, INAC, MINATEC Campus, F-38054 Grenoble, France
来源：
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2017年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low temperature direct bonding technologies are now widely used for many applications. Mechanisms of some of these technics will be presented. The different way to obtain low temperature direct bonding will then be compared with their respective advantages and drawbacks.
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页码：20 / 20
页数：1
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