Low temperature direct bonding comparison

被引：0
|
作者：
Fournel, F. [1 ]
Larrey, V. [1 ]
Morales, C. [1 ]
Bridoux, C. [1 ]
Moriceau, H. [1 ]
Rieutord, F. [1 ,2 ,3 ]
机构：
[1] Univ Grenoble Alpes, F-38000 Grenoble, France
[2] CEA Grenoble, LETI, MINATEC Campus, F-38054 Grenoble, France
[3] CEA Grenoble, INAC, MINATEC Campus, F-38054 Grenoble, France
来源：
2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2017年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Low temperature direct bonding technologies are now widely used for many applications. Mechanisms of some of these technics will be presented. The different way to obtain low temperature direct bonding will then be compared with their respective advantages and drawbacks.
引用
收藏
页码：20 / 20
页数：1
相关论文
共 50 条
  • [1] Low temperature GRISM direct bonding
    Kalkowski, Gerhard
    Harnisch, Gerd
    Grabowski, Kevin
    Benkenstein, Tino
    Ehrhardt, Sascha
    Zeitner, Uwe
    Risse, Stefan
    MATERIAL TECHNOLOGIES AND APPLICATIONS TO OPTICS, STRUCTURES, COMPONENTS, AND SUB-SYSTEMS II, 2015, 9574
  • [2] Low temperature direct bonding using pressure and temperature
    Li, YA
    Bower, RW
    MICROELECTRONIC PACKAGING AND LASER PROCESSING, 1997, 3184 : 124 - 128
  • [3] Direct bonding of low temperature heterogeneous dielectrics
    Iacovo, Serena
    Peng, Lan
    Phommahaxay, Alain
    Inoue, Fumihiro
    Verdonck, Patrick
    Kim, Soon-Wook
    Sleeckx, Erik
    Miller, Andy
    Beyer, Gerald
    Beyne, Eric
    2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2019, : 2206 - 2212
  • [4] Low temperature copper to copper direct bonding
    Univ of California, Davis, United States
    Jpn J Appl Phys Part 2 Letter, 9 A-B (L1068-L1069):
  • [5] LOW-TEMPERATURE WAFER DIRECT BONDING
    TONG, QY
    CHA, GH
    GAFITEANU, R
    GOSELE, U
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1994, 3 (01) : 29 - 35
  • [6] Low Temperature Direct Cu Bonding for MEMS Packaging
    Song, Jenn-Ming
    Liang, Sin-Yong
    Chiang, Po-Hao
    Huang, Shang-Kun
    Chiu, Ying-Ta
    Tarng, David
    Hung, Chih-Pin
    Lin, Jing-Yuan
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2017, : 57 - 60
  • [7] Hydrophilic low-temperature direct wafer bonding
    Ventosa, C.
    Rieutord, F.
    Libralesso, L.
    Morales, C.
    Fournel, F.
    Moriceau, H.
    JOURNAL OF APPLIED PHYSICS, 2008, 104 (12)
  • [8] Optimum Pressure in Low Temperature Direct Metal Bonding
    Ang, X. F.
    Liu, H. P.
    Tan, Y. L.
    Lu, H. J.
    Wei, J.
    Zhang, H. J.
    Chen, Z.
    Wong, C. C.
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 251 - 254
  • [9] Low temperature GaAs/Si direct wafer bonding
    Alexe, M
    Dragoi, V
    Reiche, M
    Gösele, U
    ELECTRONICS LETTERS, 2000, 36 (07) : 677 - 678
  • [10] Low temperature polyimide-to-polyimide direct bonding
    Liu, Hong-Che
    Chen, Chih
    PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2019, : 75 - 75
12345