3D(Dimensional)-Wired and Wireless Network-on-Chip (NoC)

被引：5
|
作者：
Ashokkumar, N. [1 ]
Nagarajan, P. [1 ]
Venkatramana, P. [1 ]
机构：
[1] Sree Vidyanikethan Engn Coll, Ctr VLSI & Embedded Syst, Dept Elect & Commun Engn, Tirupati, Andhra Pradesh, India
来源：
INVENTIVE COMMUNICATION AND COMPUTATIONAL TECHNOLOGIES, ICICCT 2019 | 2020年 / 89卷
关键词：
3D NoC (3Dimensional Network-on-Chip); TSV (Through silicon via); Wired and wireless NoC; Topology; COMPRESSION;
D O I：
10.1007/978-981-15-0146-3_12
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
Network on Chip is a special unique case of parallel computing systems defined by the tight constraints such as availability of resources, area, cost of the NoC architecture and power consumption. NoC is designed with three main components: switches, Network Interfaces (NIs) and links. NoC is used for several application domains, such as multi-media processing, consumer electronics, biological applications, etc. NoC is the technology proposed to solve the shortcoming of buses. This technique is used to design communication subsystem among IP cores (Intellectual property core) in a SoC design. In this chapter, we have discussed about 3D integrated circuits, 3D wired and wireless NoC, Emerging Technologies, and Literature Survey.
引用
收藏
页码：113 / 119
页数：7
相关论文
共 50 条
  • [1] Design Challenges for 3 Dimensional Network-on-Chip (NoC)
    AshokKumar, N.
    Nagarajan, P.
    Selvaperumal, SathishKumar
    Venkatramana, P.
    [J]. SUSTAINABLE COMMUNICATION NETWORKS AND APPLICATION, ICSCN 2019, 2020, 39 : 773 - 782
  • [2] Thermal/Traffic-aware 3D Network-on-Chip (NoC) Designs
    Wu, An-Yeu
    [J]. NINTH INTERNATIONAL WORKSHOP ON NETWORK ON CHIP ARCHITECTURES, NOCARC 2016, 2016, : 1 - 2
  • [3] Mapping Wired Links in a Hybrid Wired-Wireless Network-on-Chip
    Oliveira, Samuel da S.
    Lima, Guilherme Egle P.
    Pereira, Monica M.
    Kreutz, Marcio E.
    Carvalho, Bruno M.
    [J]. 2020 X BRAZILIAN SYMPOSIUM ON COMPUTING SYSTEMS ENGINEERING (SBESC), 2020,
  • [4] VERSAL NETWORK-on-CHIP (NoC)
    Swarbrick, Ian
    Gaitonde, Dinesh
    Ahmad, Sagheer
    Jayadev, Bala
    Cuppett, Jeff
    Morshed, Abbas
    Gaide, Brian
    Arbel, Ygal
    [J]. 2019 IEEE SYMPOSIUM ON HIGH-PERFORMANCE INTERCONNECTS (HOTI 2019), 2019, : 13 - 17
  • [5] Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements
    Chen, Kun-Chih
    Chao, Chih-Hao
    Wu, An-Yeu
    [J]. IEEE CIRCUITS AND SYSTEMS MAGAZINE, 2015, 15 (04) : 45 - 69
  • [6] On the Design of Reliable Hybrid Wired-Wireless Network-on-Chip Architectures
    Agyeman, Michael Opoku
    Wan, Ji-Xiang
    Quoc-Tuan Vien
    Zong, Wen
    Yakovlev, Alex
    Tong, Kenneth
    Mak, Terrence
    [J]. 2015 IEEE 9TH INTERNATIONAL SYMPOSIUM ON EMBEDDED MULTICORE/MANYCORE SYSTEMS-ON-CHIP (MCSOC), 2015, : 251 - 258
  • [7] On Improving the Performance of Hybrid Wired-Wireless Network-on-Chip Architectures
    Zong, Wen
    Agyeman, Michael Opoku
    [J]. NINTH INTERNATIONAL WORKSHOP ON NETWORK ON CHIP ARCHITECTURES, NOCARC 2016, 2016, : 27 - 32
  • [8] Interference Analysis for Optical Wireless Communications in Network-on-Chip (NoC) Scenarios
    Dehkordi, Jinous Shafiei
    Tralli, Velio
    [J]. IEEE TRANSACTIONS ON COMMUNICATIONS, 2020, 68 (03) : 1662 - 1674
  • [9] Reconfigurable Network-on-Chip for 3D Neural Network Accelerators
    Firuzan, Arash
    Modarressi, Mehdi
    Daneshtalab, Masoud
    Reshadi, Midia
    [J]. 2018 TWELFTH IEEE/ACM INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (NOCS), 2018,
  • [10] Wireless Interconnects for 3D Network-on-Chip with Embedded Micro Thermofluidic Cooling Channels
    Caporale, Christopher
    Venkataraman, Jayanti
    [J]. 2015 IEEE INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2015, : 1454 - 1455
12345