Thermal stability of surface-acoustic-wave devices in the microwave band

被引：2
|
作者：
Suchkov, S. G.
机构：
来源：
JOURNAL OF COMMUNICATIONS TECHNOLOGY AND ELECTRONICS | 2006年 / 51卷 / 04期
关键词：
D O I：
10.1134/S1064226906040176
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thermal stability of surface-acoustic-wave devices in the microwave band is studied in relation to the thickness and elastic properties of the metal film forming the electrode structure. Thermally stable angles of the singly rotated Y cuts of quartz plates are found for frequencies of 1 and 2 GHz. The dependence of thermal stability on the metallization ratio of the electrode structure is obtained.
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页码：474 / 478
页数：5
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