Thermally conductive, self-healing, and elastic Polyimide@Vertically aligned carbon nanotubes composite as smart thermal interface material

被引:150
|
作者
Yu, Huitao [1 ,2 ]
Feng, Yiyu [1 ,2 ,3 ]
Chen, Can [1 ,2 ]
Zhang, Zhixing [1 ,2 ]
Cai, Yu [1 ,2 ]
Qin, Mengmeng [1 ,2 ]
Feng, Wei [1 ,2 ]
机构
[1] Tianjin Univ, Sch Mat Sci & Engn, Tianjin 300350, Peoples R China
[2] Tianjin Univ, Tianjin Key Lab Composite & Funct Mat, Tianjin 300350, Peoples R China
[3] Zhengzhou Univ, Key Lab Mat Proc & Mold, Minist Educ, Zhengzhou 450002, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
Self-healability; Elasticity; Polyimide copolymers; Vertically aligned carbon nanotubes; Smart thermal interface materials;
D O I
10.1016/j.carbon.2021.04.055
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Smart thermal interface materials must exhibit self-healability and high thermal conductivity (k) and elastic deformation as they can experience repeated compression and undergo sudden damage. However, it remains challenging to ensure high phonon mobility/efficient phonon transfer, self-healing, and good elasticity by optimizing its molecular orientation or cross-links. Herein, a self-healing and elastic polyimide copolymer (EMPI) cross-linked by flexible and rigid segments is uniformly filled into the gaps of a forest of vertically aligned carbon nanotubes (VACNTs). The EMPI@VACNTs composite exhibits a high k value at 10.83 +/- 0.22 W m(-1) K-1, low interfacial thermal resistance at 6.83 +/- 0.15 K mm(2) W-1, high elastic compressive deformation (30% at 2.5 MPa), and strong surface adhesion (0.3 MPa). Further, it could recover 90.8% of its elastic modulus and 92% of its thermal resistance after self-healing at 80 degrees C for 80 h. An EMPI@VACNTs-Cu device exhibits efficient heat conduction not only by recovering after gradient compressive strains of up to 30% but also by self-healing its damage or reforming the interface with Cu. Thus, the thermally conductive, self-healing, and elastic EMPI@VACNTs composite opens new avenues for smart thermal management in various high-power/intelligent devices. (C) 2021 Elsevier Ltd. All rights reserved.
引用
收藏
页码:348 / 357
页数:10
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