Thermal management for semiconductor devices with conductive polymers

被引：11

作者：

Feng, J ^{[1
]}

Ellis, TW ^{[1
]}

机构：

[1] Kulicke & Soffa, Willow Grove, PA 19090 USA

来源：

SYNTHETIC METALS | 2003年 / 135卷 / 1-3期

关键词：

polyaniline and derivatives; polythiophene and derivatives; conjugated polymers; thermoelectrics; heterostructures; nano-composites;

D O I：

10.1016/S0379-6779(02)00606-9

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Different microstructures for heat conduction have been evaluated for IC polymeric materials. Certain conjugated polymers with very high Seebeck coefficient have been considered for thermoelectric cooling. A model has been proposed that these conjugated polymers at their non-doped state will be blended with nano-size conducting species.

引用

页码：155 / 156

页数：2

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