Thermal management for semiconductor devices with conductive polymers

被引：11
|
作者：
Feng, J [1 ]
Ellis, TW [1 ]
机构：
[1] Kulicke & Soffa, Willow Grove, PA 19090 USA
来源：
SYNTHETIC METALS | 2003年 / 135卷 / 1-3期
关键词：
polyaniline and derivatives; polythiophene and derivatives; conjugated polymers; thermoelectrics; heterostructures; nano-composites;
D O I：
10.1016/S0379-6779(02)00606-9
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Different microstructures for heat conduction have been evaluated for IC polymeric materials. Certain conjugated polymers with very high Seebeck coefficient have been considered for thermoelectric cooling. A model has been proposed that these conjugated polymers at their non-doped state will be blended with nano-size conducting species.
引用
收藏
页码：155 / 156
页数：2
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