共 50 条
- [43] Bondability of Cu wire on Cu substrate with Sn plating by ultrasonic Yosetsu Gakkai Ronbunshu/Quarterly Journal of the Japan Welding Society, 2010, 28 (04): : 362 - 368
- [44] EFFECTS OF GOLD-PLATING ADDITIVES ON SEMICONDUCTOR WIRE BONDING PLATING AND SURFACE FINISHING, 1981, 68 (11): : 58 - 61
- [46] MULTIPLE WIRE ROLLING MACHINE FOR PRODUCTION OF NON-FERROUS METAL WIRE WIRE, 1969, (100): : 81 - &
- [50] Pin Assignment for Wire Length Minimization after Floorplanning Phase 2009 IEEE 8TH INTERNATIONAL CONFERENCE ON ASIC, VOLS 1 AND 2, PROCEEDINGS, 2009, : 1294 - 1297