IN-PLANE AND OUT-OF-PLANE ANALYSES OF ENCAPSULATED MEMS DEVICE BY IR LASER VIBROMETRY

被引：1

作者：

Ennen, Matte ^{[1
]}

Lherbette, Michael L. ^{[1
]}

机构：

[1] SmarAct GmbH, Metrol, Oldenburg, Germany

来源：

2022 IEEE 35TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS CONFERENCE (MEMS) | 2022年

关键词：

Vibrometry; in-plane; out-of-plane; MEMS;

D O I：

10.1109/MEMS51670.2022.9699714

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microelectromechanical systems (MEMS) are often packaged in silicon enclosures that keep their microenvironment well controlled, a crucial aspect for their good operation. With conventional optical techniques, it is however impossible to evaluate their dynamic performance without opening up their enclosures and subsequently disturbing their working conditions. The vibrometry technology that is presented here utilizes an infrared (IR) laser source and a confocal detection scheme, which paves the way to analyze the behavior of multilayered siliconen-capsulated MEMS, whether it comes to in-plane or out-of-plane vibrations.

引用

页码：814 / 817

页数：4

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