Monitoring interlaminar crack growth in ceramic matrix composites using electrical resistance

被引:40
|
作者
Mansour, Rabih [1 ]
Maillet, Emmanuel [1 ]
Morscher, Gregory N. [1 ]
机构
[1] Univ Akron, Dept Mech Engn, Akron, OH 44325 USA
关键词
Ceramic matrix composites (CMC); Electrical resistivity; Fracture; Acoustic emission; ACOUSTIC-EMISSION; DAMAGE; EVENTS;
D O I
10.1016/j.scriptamat.2014.10.034
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
This letter introduces a method that uses electrical resistance to monitor crack growth during interlaminar fracture testing of woven SiC fiber-reinforced SiC matrix composites at room temperature without visual observation. The estimated crack length is in excellent agreement with the measured length after subtracting a constant value of resistance related to the initial stage of crack development. This non-visual monitoring method holds great promise for in situ measurement of crack growth during high-temperature testing of ceramic matrix composites. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:9 / 12
页数:4
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