Fabrication of semiconductor optical switch module using laser welding technique

被引:0
|
作者
Kang, SG [1 ]
Song, MK
Park, SS
Lee, SH
Hwang, N
Lee, HT
Oh, KR
Joo, GC
Lee, D
机构
[1] XL Photon Inc, Taejon 305333, South Korea
[2] Elect & Telecommun Res Inst, Taejon 305350, South Korea
[3] Chungnam Natl Univ, Dept Phys, Taejon 305764, South Korea
来源
关键词
array packaging; laser welding; multichannel optical device; semiconductor optical snitch; tapered fiber array;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The 4 x 4, 1 x 2, and 1 x 4 semiconductor optic-switch modules for 1550 nm optical communication systems were fabricated by using the laser welding technique based on the 30-pin butterfly package. For better coupling efficiency between a switch chip and an optical fiber, tapered fibers of 10-15 mum lens radius were used to provide the coupling efficiency up to 60%. The lens to lens distance of the assembled tapered fiber array was controlled within +/-1.0 mum. A laser hammering technique was introduced to adjust the radial shift, which was critical to obtain comparable optical coupling efficiencies from all the channels at the same time. The fabricated optical switch modules showed good thermal stability, with less than 5% degradation after a 200 thermal cycling. The transmission characteristics of the 4 x 4 snitch module showed good sensitivities, providing error free transmissions below -30 dBm for all the switching paths, The dynamic ranges for the 4 x 4 and 1 x 2 snitch modules were about 8 dB for a 3 dB penalty and about 17 dB for a 2 dB penalty, respectively.
引用
收藏
页码:672 / 680
页数:9
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