Architectures of semiconductor in automotive applications

被引:0
|
作者
Schmidt, C [1 ]
Kornmayer, J [1 ]
机构
[1] Robert Bosch GmbH, Reutlingen, Germany
来源
FOCUS ON VEHICLE ELECTRONICS | 2004年 / 1866卷
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We will explore the influence of the system architecture of the automotive electronics and of the semiconductor technology on the partitioning and architecture of semiconductors for automotive applications. It will be demonstrated that domain oriented and segmented architectures for the electronics of automobiles will enforce the application of ASSP vs. ASIC especially in basic segments which are dominated by cost. The development of semiconductor technology allows in parallel the development of more and more integrated solutions. But this can only be achieved by utilizing techniques optimised for the application. Therefore, one-chip designs will be the exception, two- or more-chip designs will dominate. Modulare, scalable designs will increase flexibility in the case of cost optimised segments. Future architectures most probably will use intelligent sensors/actuators and therefore will allow highest integration of the peripheral IC.
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页码:221 / 233
页数:13
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