Simultaneous fault detection and classification for semiconductor manufacturing tools

被引:0
|
作者
Goodlin, BE [1 ]
Boning, DS [1 ]
Sawin, HH [1 ]
Wise, BM [1 ]
机构
[1] MIT, Cambridge, MA 02139 USA
来源
PLASMA PROCESSING XIV | 2002年 / 2002卷 / 17期
关键词
D O I
暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Increasingly there is a need for fast, accurate, and sensitive detection of equipment and process faults to maintain high process yields and rapid fault classification (diagnosis) of the cause to minimize tool downtime in semiconductor manufacturing. Current methods treat fault detection and classification as a two-step process. We present a novel method to simultaneously detect and classify faults in a single-step using fault-specific control charts. These control charts are designed to discriminate between specific fault classes and the normal process operation as well as all other fault classes. Using a set of experimental data collected from an industrial plasma etcher, we demonstrate that if the fault-specific charts are constructed using an orthogonal linear discriminant approach, they are effective in simultaneously detecting and classifying a given fault. We also demonstrate that this methodology has improved sensitivity for detection of faults when compared to other commonly used methods of fault detection.
引用
收藏
页码:137 / 153
页数:17
相关论文
共 50 条
  • [31] Fault Detection on Variable Length Multivariate Time Series from Semiconductor Manufacturing
    Tchatchoua, Philip
    Graton, Guillaume
    Ouladsine, Mustapha
    Christaud, Jean-Francois
    2023 IEEE SENSORS, 2023,
  • [32] Joint modeling of classification and regression for improving faulty wafer detection in semiconductor manufacturing
    Kang, Seokho
    JOURNAL OF INTELLIGENT MANUFACTURING, 2020, 31 (02) : 319 - 326
  • [33] Joint modeling of classification and regression for improving faulty wafer detection in semiconductor manufacturing
    Seokho Kang
    Journal of Intelligent Manufacturing, 2020, 31 : 319 - 326
  • [34] Construcing a FDC framework with embedded statistical models for semiconductor fault detection and classification
    Chen, PN
    Chien, CF
    Luo, HJ
    Dai, HA
    Wang, SJ
    PROCEEDINGS OF THE 11TH INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT, VOLS 1 AND 2: INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT IN THE GLOBAL ECONOMY, 2005, : 1311 - 1314
  • [35] Control and optimization of cluster tools in semiconductor manufacturing
    Dümmler, M
    OPERATIONS RESEARCH PROCEEDINGS 2000, 2001, : 295 - 300
  • [36] Conducting early assessments of semiconductor manufacturing tools
    Krauss, Mark A.
    Frankfurth, Mark S.
    MICRO, 2006, 24 (06): : 57 - +
  • [37] Automatic defect classification for semiconductor manufacturing
    I.B.M., Yorktown Heights, United States
    Mach Vision Appl, 4 (201-214):
  • [38] Automatic defect classification for semiconductor manufacturing
    Paul B. Chou
    A. Ravishankar Rao
    Martin C. Sturzenbecker
    Frederick Y. Wu
    Virginia H. Brecher
    Machine Vision and Applications, 1997, 9 : 201 - 214
  • [39] Automatic defect classification for semiconductor manufacturing
    Chou, PB
    Rao, AR
    Sturzenbecker, MC
    Wu, FY
    Brecher, VH
    MACHINE VISION AND APPLICATIONS, 1997, 9 (04) : 201 - 214
  • [40] Controlling etch tools using real-time fault detection and classification
    Chen, MS
    Yen, TF
    Coonan, B
    MICRO, 2005, 23 (02): : 59 - +