Testability and signal integrity in a low cost multichip module

被引：0
|
作者：
Omer, A
Flint, A
机构：
来源：
EIGHTH ANNUAL IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON, 1996 PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/ICISS.1996.552426
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The design process for low-cost multichip modules is presented. Modifications to the design are often made in order to increase testability. Some of these modifications can degrade signal integrity, however. The important aspects to consider in order to make rational design tradeoffs are presented.
引用
收藏
页码：189 / 197
页数：9
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