Investigation of creep behavior of a lead-free solder alloy Sn96.5Ag3.5

被引：0
|
作者：
Zhu, Fulong [1 ]
Zhang, Honghai [1 ]
Guan, Rongfeng [1 ]
Liu, Sheng [1 ]
机构：
[1] Huazhong Univ Sci & Technol, Inst Microsyst, Wuhan Natl Lab Optoelect, 1037 Luoyu Rd, Wuhan 430074, Peoples R China
来源：
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2006年
基金：
国家高技术研究发展计划(863计划);
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The creep properties of the lead-free solder alloy Sn96.5Ag3.5 were investigated and compared with those of the typical Pb-containing solder Sn63Pb37. Creep tests of this lead-free solder Sn96.5Ag3.5 and Pb-containing solder Sn63Pb37 at different temperature of 25 degrees C, 125 degrees C were conducted at different constant stress levels and a series of consistent and reliable creep data were obtained. It could be found that circumstance temperature was the key part to affect the creep property of two solder alloys Sn96.5Ag3.5 and Sn63Pb37. The lead-free solder alloy Sn96.5Ag3.5 showed good creep resistance and deformation resistance; the creep behavior of this lead-free solder Sn96.5Ag3.5 revealed the temperature sensitivity. This lead-free solder alloy Sn96.5Ag3.5 will substitute the typical Pb-containing solder alloys as the interconnecting and packaging materials in some microelectronic component encapsulation and assembly.
引用
收藏
页码：188 / +
页数：2
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