Smooth and anisotropic dry etching of InGaAlAs using Cl2/N2 ECR plasma

被引:0
|
作者
Uchiyama, H [1 ]
Shinoda, K [1 ]
Sato, H [1 ]
Taike, A [1 ]
Taniguchi, T [1 ]
Tsuji, S [1 ]
机构
[1] Hitachi Ltd, Cent Res Lab, Kokubunji, Tokyo 1858601, Japan
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We developed a dry etching process for fabricating InGaAlAs laser mesa stripes and used it to fabricate an InGaAlAs-BH laser. We used optimized Cl-2/N-2 ECR plasma for the etching of an InGaAlAs laser multilayer structure. Use of this Cl-2/N-2 ECR plasma resulted in a uniform etching rate and resulted in an anisotropic etching by a nitrified side-protection mechanism. This smooth and anisotropic dry etching thus produced a well-matched interface between the etched surface and the semi-insulated Fe-InP regrown surface. The fabricated InGaAlAs-BH laser showed the stable operation at 85degreesC.
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页码:468 / 471
页数:4
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