Thermal behaviour of melamine-modified urea-formaldehyde resins

被引：34

作者：

Siimer, Kadri ^{[1
]}

Kaljuvee, Tiit ^{[1
]}

Pehk, Tonis ^{[2
]}

Lasn, Ilmar ^{[3
]}

机构：

[1] Tallinn Univ Technol, EE-19086 Tallinn, Estonia

[2] NICPB, EE-12618 Tallinn, Estonia

[3] Parnu Plaaditehas AS, EE-80041 Parnu, Estonia

来源：

JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY | 2010年 / 99卷 / 03期

关键词：

Curing; C-13; NMR; Particleboards; TG-DTA analysis; Urea-formaldehyde modified resins; ADHESIVES; PARTICLEBOARD; ACTIVATION; EMISSION; FTIR;

D O I：

10.1007/s10973-009-0617-z

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Thermal behaviour of industrial UF resins modified by low level of melamine was followed by TG-DTA technique on the labsys (TM) instrument Setaram together with the C-13 NMR analysis of resin structure and testing boards in current production at Estonian particleboard factory Parnu Plaaditehas AS. DTA curve of UF resin which has been cocondensed during synthesis with even low level of melamine shows the shift of condensation exotherm and water evaporation endotherm to considerable higher temperatures. The effect of melamine monomer introduced to UF resin just before curing was compared. The effect of addition of urea as formaldehyde scavenger was studied.

引用

页码：755 / 762

页数：8

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