Photoresist characteristics of polyurea films prepared by vapor deposition polymerization

被引：8
|
作者：
Sato, M [1 ]
Iijima, M [1 ]
Takahashi, Y [1 ]
机构：
[1] Ulvac Japan Ltd, Tsukuba Inst Super Mat, Ibaraki, Osaka 30026, Japan
来源：
THIN SOLID FILMS | 1997年 / 308卷
关键词：
photoresist characteristics; polyurea films; vapor deposition polymerization;
D O I：
10.1016/S0040-6090(97)00553-1
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Aromatic polyurea was prepared by vapor deposition polymerization of 4,4-diaminodiphenyl methane and 4,4-diphenylmethane diisocyanate. Mass spectrometric analysis revealed depolymerization of the polyurea. The polyurea evaporated completely at 300 degrees C or lower in vacuum. UV exposed polyurea did not evaporate even at temperatures higher than 300 degrees C. To exploit the thermal resistance of the exposed and unexposed polyurea, patterned films were prepared with 5 mu m resolution. It was found that the polyurea could be used as a negative resist material, and that an all-dry lithographic process was possible. (C) 1997 Elsevier Science S.A.
引用
收藏
页码：90 / 93
页数：4
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