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Surface Modification of Polyimide Film by Dielectric Barrier Discharge at Atmospheric Pressure

被引：10
|
作者：
Peng Shi [1 ]
Li Lingjun [2 ]
Li Wei [1 ]
Wang Chaoliang [2 ]
Guo Ying [2 ]
Shi Jianjun [2 ]
Zhang Jing [2 ]
机构：
[1] Donghua Univ, Coll Text, Shanghai 201620, Peoples R China
[2] Donghua Univ, Dept Appl Phys, Shanghai 201620, Peoples R China
来源：
PLASMA SCIENCE & TECHNOLOGY | 2016年 / 18卷 / 04期
关键词：
DBD; atmospheric pressure; surface modification; polyimide; treatment duration; PLASMA MODIFICATION; POLYMERS; ADHESION; METAL;
D O I：
10.1088/1009-0630/18/4/01
中图分类号：
O35 [流体力学]; O53 [等离子体物理学];
学科分类号：
070204 ; 080103 ; 080704 ;
摘要：
In this paper, polyimide (PI) films are modified using an atmospheric pressure plasma generated by a dielectric barrier discharge (DBD) in argon. Surface performance of PI film and its dependence on exposure time from 0 s to 300 s are investigated by dynamic water contact angle (WCA), field emission scanning electron microscopy (FESEM), and Fourier transform infrared spectroscopy in attenuated total multiple reflection mode (FTIR-ATR). The study demonstrates that dynamic WCA exhibits a minimum with 40 s plasma treatment, and evenly distributed nano-dots and shadow concaves appeared for 40 s and 12 s Ar plasma treatment individually. A short period of plasma modification can contribute to the scission of the imide ring and the introduction of C-O and C-O (-COOH) by detailed analysis of FTIR-ATR.
引用
收藏
页码：337 / 341
页数：5
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