Effect of H2 Reduction Temperature on the Properties of Reduced Graphene Oxide and Copper Matrix Composites

Reduced graphene oxide (RGO) and copper composites (RGO/Cu) were successfully fabricated based on a molecular-level mixing method (MLM). The composite powders were reduced in H-2 at 350, 450, and 550 C and then consolidated by spark plasma sintering (SPS) in order to evaluate the effect of H-2 reduction temperature on the properties of the composites. The results indicate that the strengths of the composite decrease with the increase of H-2 reduction temperature, while the electrical conductivity reaches its maximum at 450 degrees C and minimum at 550 degrees C. Hot rolling could benefit the electrical conductivity. The yield strength of the RGO/Cu composite reduced to 337 MPa at 350 degrees C. The electrical conductivity of the RGO/Cu composite reduced at 450 degrees C after hot rolling reaches 60.26% IACS. The properties of the RGO/Cu composites can be designed by adjusting the reduction degree of RGO and by hot rolling.