Early life reliability growth testing with non-constant failure intensity

被引:1
|
作者
Haselgruber, Nikolaus [1 ]
Capser, Shawn P. [2 ]
Vignati, Giorgio, I [3 ]
机构
[1] CIS Consulting Ind Stat GmbH, Wendgasse 15, A-4170 Haslach, Austria
[2] ESi Inc, 1174 Oak Valley Dr, Ann Arbor, MI 48108 USA
[3] ITI Srl, Via Michele Novaro 16, I-20161 Milan, Italy
关键词
Reliability growth; early life; warranty; repairable objects; failure rate; product quality; product performance;
D O I
10.1016/j.procs.2021.01.283
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
Early-life reliability is a key characteristic for complex technical products as it addresses the very first time-span of product use. Any unreliability in this phase jeopardizes both customer satisfaction, as well as warranty costs and finally the economic success. Review of several early-life warranty cases shows a mix of classical reliability issues, i.e., problems occurring during usage time, and quality related issues that often manifest themselves during initial inspections by product quality or even the customer, i.e., at usage time t = 0. Classical reliability growth models do not explicitly consider these two different sources of unreliability but require zero failures at time zero and provide time-dependent reliability estimates. We present a model which shares the concept of time-dependent reliability measures but considers in addition the initial quality issues. By taking advantage of well-known reliability growth models and basic statistical principles we were able to provide a flexible approach useful for practical application. (C) 2021 The Authors. Published by Elsevier B.V.
引用
收藏
页码:608 / 617
页数:10
相关论文
共 50 条
  • [21] System-Level Reliability Analysis of a Repairable Power Electronic-Based Power System Considering Non-Constant Failure Rates
    Davoodi, Amirali
    Yang, Yongheng
    Dragicevic, Tomislav
    Blaabjerg, Frede
    [J]. 2020 22ND EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'20 ECCE EUROPE), 2020,
  • [22] Non-constant diffusion characteristics of nanoscopic Mo-Si interlayer growth
    Bosgra, J.
    Verhoeven, J.
    van de Kruijs, R. W. E.
    Yakshin, A. E.
    Bijkerk, F.
    [J]. THIN SOLID FILMS, 2012, 522 : 228 - 232
  • [23] Complex dynamics in the neoclassical growth model with differential savings and non-constant labor force growth
    Brianzoni, Serena
    Mam-mana, Cristiana
    Michetti, Elisabetta
    [J]. STUDIES IN NONLINEAR DYNAMICS AND ECONOMETRICS, 2007, 11 (03):
  • [24] Endmill condition monitoring and failure forecasting method for curvilinear cuts of non-constant radii
    Suprock, Christopher A.
    Roth, John T.
    Downey, Larry M.
    [J]. PROCEEDINGS OF THE ASME INTERNATIONAL CONFERENCE ON MANUFACTURING SCIENCE AND ENGINEERING - 2007, 2007, : 507 - 516
  • [25] PFD calculation in case of non-constant failure rates - Solving Multiphase Markov Model with Matchcad
    Hildebrandt, Andreas
    [J]. ATP EDITION, 2012, (06): : 40 - 46
  • [27] Optimal design for reliability improvement experiments with a non-constant scale parameter (sept, 10.1080/16843703.2023.2255373, 2023)
    Wang, Guodong
    Li, Xiaoyang
    Fang, Guanqi
    He, Zhen
    Vining, Geoff
    [J]. QUALITY TECHNOLOGY AND QUANTITATIVE MANAGEMENT, 2023,
  • [28] Preventive Maintenance for Cloud-Based Software Systems Subject to Non-Constant Failure Rates
    Rahme, Jean
    Xu, Haiping
    [J]. 2017 IEEE SMARTWORLD, UBIQUITOUS INTELLIGENCE & COMPUTING, ADVANCED & TRUSTED COMPUTED, SCALABLE COMPUTING & COMMUNICATIONS, CLOUD & BIG DATA COMPUTING, INTERNET OF PEOPLE AND SMART CITY INNOVATION (SMARTWORLD/SCALCOM/UIC/ATC/CBDCOM/IOP/SCI), 2017,
  • [29] Stopping Criteria for Regression Testing in GUI Application using Failure Intensity and Failure Reliability
    Somsorn, Chalita
    Sophatsathit, Peraphon
    [J]. PROCEEDINGS OF 2015 6TH IEEE INTERNATIONAL CONFERENCE ON SOFTWARE ENGINEERING AND SERVICE SCIENCE, 2015, : 289 - 292
  • [30] PREDICTION OF THE RELIABILITY OF MECHANICAL COMPONENTS SUBJECTED TO COMBINED ALTERNATING AND MEAN STRESSES WITH NON-CONSTANT STRESS RATIO
    KECECIOGLU, D
    LAMARRE, G
    [J]. MICROELECTRONICS AND RELIABILITY, 1980, 20 (1-2): : 45 - 54