共 50 条
- [1] Investigation on Damage Behavior of Lead-free Solder Joints Based on Finite Element Modeling 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 14 - 18
- [2] The Finite Element Simulation and Nanoindentation Methods for the Study of Mechanical Behavior of Lead-free Solder Joints 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [4] Damage mechanics and experiments of lead-free solder alloy 2006 CONFERENCE ON OPTOELECTRONIC AND MICROELECTRONIC MATERIALS & DEVICES, 2006, : 286 - 289
- [5] The Theoretical Exploration of Fracture Mechanics for Lead-Free Solder Joints 2010 INTERNATIONAL CONFERENCE ON MANAGEMENT SCIENCE AND ENGINEERING (MSE 2010), VOL 1, 2010, : 265 - 268
- [7] Finite element analysis for lead-free solder joints under a board level drop impact J Vib Shock, 2008, 2 (75-77):
- [10] A Continuum Damage Mechanics Approach for the Reliability of Lead-Free Solders Subjected to Cyclic Loading 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC, 2023, : 713 - 720