Finite element analysis for lead-free solder joints under a board level drop impact

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作者：
State Key Laboratory of Mechanical System and Vibration, Shanghai Jiaotong University, Shanghai 200240, China [1 ]
不详 [2 ]
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来源：
J Vib Shock | 2008年 / 2卷 / 75-77期
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Printed circuit boards;
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