ZrO2 as a high-κ dielectric for strained SiGe MOS devices

被引:4
|
作者
Mahapatra, R
Kar, GS
Samantaray, CB
Dhar, A
Bhattacharya, D
Ray, SK [1 ]
机构
[1] Indian Inst Technol, Dept Phys & Meteorol, Kharagpur 721302, W Bengal, India
[2] Indian Inst Technol, Ctr Mat Sci, Kharagpur 721302, W Bengal, India
关键词
ZrO2; high-kappa dielectric; SiGe MOS devices;
D O I
10.1007/BF02710526
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The potential of ZrO2 thin film as a high-kappa gate dielectric for scaled MOSFET devices has been studied. ZrO2 has been deposited directly on a Si0.8Ge0.2 substrate by reactive RF magnetron sputtering. An equivalent oxide thickness of < 20 Angstrom with a leakage current of the order of 10(-4) A/cm(2) at 1 V has been obtained. Well-behaved capacitance-voltage characteristics with an interface state density of 2 x 10(11) cm(-2) eV(-1) have been achieved. The deposited dielectric exhibits low charge trapping under constant current stressing.
引用
收藏
页码:455 / 457
页数:3
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