Determining Reliability of Electronics Via Radiated Emissions Analysis

This paper presents recent results in using electromagnetic (EM) emission signature analysis to assess the reliability and condition of electronic components. Results indicate that unintended radiated EM emissions analysis made using high sensitivity equipment can significantly augment traditional reliability testing methods to increase confidence in electronic component performance. This paper shows results on studies undertaken to determine piece part and component reliability on multiple fronts. The first portion of the paper presents results on a study aimed at determining reliability of piece parts used in a critical system. This study involved EM emissions analysis of over 1300 custom Application Specific Integrated Circuits (ASICs), from which multiple specimens displayed reduced reliability based on analysis of Radio Frequency (RF) EM signatures emitted by the specimens under test. The second portion of this paper discusses utilization of low-level RF emissions signatures to prognosticate Remaining Useful Life (RUL) of populated avionics devices. The results of each of these studies provides a promising avenue toward proactive electronics reliability assurance achieved through analysis of EM emissions signatures necessarily produced by all electronics.