Layout based thermal simulations of 3D integrated circuits

被引：0
|
作者：
Slusarczyk, K [1 ]
Kaminski, M [1 ]
Napieralski, A [1 ]
机构：
[1] Tech Univ Lodz, Dept Microelect & Comp Sci, Lodz, Poland
来源：
MODERN PROBLEMS OF RADIO ENGINEERING, TELECOMMUNICATIONS AND COMPUTER SCIENCE, PROCEEDINGS | 2004年
关键词：
3D thermal simulation; localized heating; ASIC;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
in this paper a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real Application Specific Integrated Circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several cooling conditions was also made and presented in the paper.
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页码：79 / +
页数：2
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