Silicon-glass anodic bonding

被引：0

作者：

Aljancic, U ^{[1
]}

Resnik, D ^{[1
]}

Vrtacnik, D ^{[1
]}

Mozek, M ^{[1
]}

Amon, S ^{[1
]}

机构：

[1] Univ Ljubljana, Fac Elect Engn, Lab Microsensor Struct & Elect, Ljubljana 1000, Slovenia

来源：

INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2004年 / 34卷 / 03期

关键词：

anodic bonding; silicon; Pyrex glass; piezoresistive pressure sensor;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Piezoresistive pressure sensors test structures fabricated on the Same silicon wafer were anodic bonded to Pyrex glass wafer and bonding characteristics were analyzed. Surface profiles of both, silicon and Pyrex wafer, were measured before and after bonding process using Taylor-Hobson Talysurf surface profiler. A simple test method for non-destructive in-situ evaluation of both, anodic bonding parameters and bond quality was introduced. Possible causes for thin silicon diaphragms deflection, detected after anodic bonding process, were analyzed and discussed.

引用

页码：168 / 173

页数：6

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