Three-dimensional electrochemical micromachining on metal and semiconductor by confined etchant layer technique (CELT)

被引：0
|
作者：
Tang, Jing [1 ]
Zhang, Li [1 ]
Jiang, Li M. [1 ]
Xie, Lei [1 ]
Zu, Yan B. [1 ]
Tian, Zhao W. [1 ,2 ]
机构：
[1] Xiamen Univ, Coll Chem & Chem Engn, Dept Chem, Xiamen, Peoples R China
[2] Xiamen Univ, State Key Lab Phys Chem Solid Surfaces, Xiamen, Peoples R China
来源：
2007 2ND IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1-3 | 2007年
基金：
美国国家科学基金会;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We developed a technology for three dimensional (3D) electrochemical micromachining. The confined etchant layer technique (CELT) has been applied to achieve effective three-dimensional (3D) micromachining on different kinds of metals and semiconductors. This technique operates on the basis of indirect electrochemical process, and is a low-cost technique for microfabrication of arbitrary 3D structures in a single step.
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页码：30 / +
页数：3
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