Transmission Line Design for Testing High-Speed Integrated Circuits with Differential Signals

被引：0
|
作者：
Thaker, Nandish Bharat [1 ,4 ]
Ashok, Rakesh [2 ]
Manikandan, Sarath [2 ]
Nambath, Nandakumar [3 ]
Gupta, Shalabh [2 ]
机构：
[1] Intel Technol India Pvt Ltd, Silicon Photon Prod Div, Bengaluru 560103, India
[2] Indian Inst Technol, Dept Elect Engn, Mumbai 400076, Maharashtra, India
[3] IIT Goa, Sch Elect Sci, Ponda 403401, India
[4] Indian Inst Technol, Dept Elect Engn, Mumbai 400076, Maharashtra, India
来源：
2019 23RD IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI 2019) | 2019年
关键词：
Die-on-board; high-speed PCB; analog IC testing; PCB transmission lines;
D O I：
10.1109/sapiw.2019.8781648
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
We present a broadband differential transmission line design for a printed circuit board (PCB) used to test an analog processing-based equalizer integrated circuit (IC). The transmission line is accurately designed and characterized with the aid of differential, common-mode, and mode conversion S-parameters in the frequency range of interest. The designed transmission line structure is to be used with a die-on-board (DOB) PCB. The PCB designed on Rogers RT duroid 6010M laminate is used to validate an IC, which will be wire-bonded to the PCB, that has 16 broadband signals of up to 25 GBd baud rate each. A detailed discussion on the design and simulation of the on-PCB transmission line is given. Simulated mixed-mode S-parameters of the transmission line for a frequency range of 100 MHz to 25 GHz confirm the broadband performance of the PCB.
引用
收藏
页数：4
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