DEVELOPMENT OF WAFER PROBE TESTING METHOD AND FEM SIMULATION MODEL

被引：0
|
作者：
Liu, D. S. [1 ]
Chang, C. M. [1 ]
Cheng, K. L. [1 ]
Liu, John [2 ]
Ho, S. C. [2 ]
Tsai, H. Y. [2 ]
机构：
[1] Natl Chung Cheng Univ, Dept Mech Engn, 160 San Hsing, Chiayi 621, Taiwan
[2] ChipMOS Technol Inc, Tainan, Taiwan
来源：
IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE | 2009年
关键词：
DESIGN; CARD;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Prober testers have been widely used by the semiconductor industry to determine whether the individual Integrated Circuits (IC) meet specifications of design. In this paper, probe contact tests are developed with different testing overdrive distance by using a micro-force tester. The probe tests are subsequently applied to a single tungsten needle probe to examine the relationships between contact force and scrub mark size on aluminum pads at various overdrive levels. A FE base simulation model was built and the simulation results were compared with testing output. The changing of the friction coefficient between pad and needle were studied, the results shown that it might be a key factor to control the scrubbing mark size
引用
收藏
页码：455 / +
页数：2
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