3D IC for future HEP detectors

被引：3

作者：

Thom, J. ^{[1
]}

Lipton, R. ^{[2
]}

Heintz, U. ^{[3
]}

Johnson, M. ^{[2
]}

Narain, M. ^{[3
]}

Badman, R. ^{[1
]}

Spiegel, L. ^{[2
]}

Triphati, M. ^{[4
]}

Deptuch, G. ^{[2
]}

Kenney, C. ^{[5
]}

Parker, S. ^{[6
]}

Ye, Z. ^{[2
]}

Siddons, D. P. ^{[7
]}

机构：

[1] Cornell Univ, Ithaca, NY 14850 USA

[2] Fermilab Natl Accelerator Lab, Batavia, IL USA

[3] Brown Univ, Providence, RI 02912 USA

[4] Univ Calif Davis, Davis, CA USA

[5] SLAC, Menlo Pk, CA USA

[6] Univ Hawaii, Honolulu, HI 96822 USA

[7] BNL, Upton, NY USA

来源：

JOURNAL OF INSTRUMENTATION | 2014年 / 9卷

基金：

美国国家科学基金会; 美国能源部;

关键词：

Si microstrip and pad detectors; Electronic detector readout concepts (solid-state); Particle tracking detectors (Solid-state detectors); SENSORS;

D O I：

10.1088/1748-0221/9/11/C11005

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

Three dimensional integrated circuit technologies offer the possibility of fabricating large area arrays of sensors integrated with complex electronics with minimal dead area, which makes them ideally suited for applications at the LHC upgraded detectors and other future detectors. We describe ongoing R&D efforts to demonstrate functionality of components of such detectors. This includes the study of integrated 3D electronics with active edge sensors to produce "active tiles" which can be tested and assembled into arrays of arbitrary size with high yield.

引用

页数：8

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