Laser Direct Write micro-fabrication of large area electronics on flexible substrates

To date, Laser Direct Write (LDW) techniques, such as Laser Induced Forward Transfer (LIFT), selective laser ablation and selective laser sintering of metal nanoparticle (NP) ink layers are receiving growing attention for the printing of uniform and well-defined conductive patterns with resolution down to 10 mu m. For flexible substrates in particular, selective laser sintering of such NP patterns has been widely applied, as a low temperature and high resolution process compatible with large area electronics. In this work, LDW of silver NP inks has been carried out on polyethylene-terephthalate (PET), polyethylenenaphthalate (PEN) and polyimide (PI) substrates to achieve low electrical resistivity electrodes. In more detail, high speed short pulsed (picosecond and nanosecond) lasers with repetition rates up to 1 MHz were used to print (LIFT) metal NP inks. We thus achieved uniform and continuous patterns with a minimum feature size of 1 mu m and a total footprint larger than 1 cm(2). Next, the printed patterns were laser sintered with ns pulses at 532 nm over a wide laser fluence window, resulting in an electrical resistivity of 10 mu Omega cm. We carried out spatial beam shaping experiments to achieve a top-hat laser intensity profile and employed selective laser ablation of thin films (thickness on the order of 100 nm) to produce silver micro-electrodes with a resolution on the order of 10 pin and a low line edge roughness. Laser sintering was combined with laser ablation to constitute a fully autonomous micro-patterning technique of metallic micro-features, with a 10 pin resolution and geometrical characteristics tuned for interdigitated electrodes for sensor applications. (C) 2015 Elsevier B.V. All rights reserved.