Characterization of reconstituted mica paper capacitors used in high voltage and high temperature power electronics applications

被引:0
|
作者
Bowers, JS [1 ]
机构
[1] CUSTOM ELECT INC,ONEONTA,NY 13820
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:737 / 742
页数:6
相关论文
共 50 条
  • [41] APPLICATIONS OF HIGH-VOLTAGE PAPER-ELECTROPHORESIS FOR THE CHARACTERIZATION OF DRUG METABOLITES
    BELL, JA
    BRADBURY, A
    MARTIN, LE
    TANNER, RJN
    XENOBIOTICA, 1981, 11 (12) : 841 - 847
  • [42] On the Reliability of Voltage and Power as Input Parameters for the Characterization of High Power Ultrasound Applications
    Haller, Julian
    Wilkens, Volker
    12TH INTERNATIONAL SYMPOSIUM ON THERAPEUTIC ULTRASOUND, 2012, 1503 : 276 - 281
  • [43] High temperature embedded SiC chip module (ECM) for power electronics applications
    Yin, Jian
    Liang, Zhenxian
    van Wyk, Jacobus Daniel
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2007, 22 (02) : 392 - 398
  • [44] Degradation of thermal interface materials for high-temperature power electronics applications
    Skuriat, R.
    Li, J. F.
    Agyakwa, P. A.
    Mattey, N.
    Evans, P.
    Johnson, C. M.
    MICROELECTRONICS RELIABILITY, 2013, 53 (12) : 1933 - 1942
  • [45] Review of On-line Junction Temperature Measurement Methods of High Voltage Power Electronics
    Chen J.
    Deng E.
    Zhao Y.
    Zhao Z.
    Huang Y.
    Zhongguo Dianji Gongcheng Xuebao/Proceedings of the Chinese Society of Electrical Engineering, 2019, 39 (22): : 6677 - 6687
  • [46] Investigation on Power Electronics Topologies for Inductive Power Transfer (IPT) Systems in High Power Low Voltage Applications
    Petersen, Marinus
    Fuchs, Friedrich W.
    2015 17TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'15 ECCE-EUROPE), 2015,
  • [47] Characterization of Encapsulants for High-Voltage, High-Temperature Power Electronic Packaging
    Yao, Yiying
    Chen, Zheng
    Lu, Guo-Quan
    Boroyevich, Dushan
    Ngo, Khai D. T.
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 1834 - 1840
  • [48] SiC for applications in high-power electronics
    Brandt, CD
    Clarke, RC
    Siergiej, RR
    Casady, JB
    Sriram, S
    Agarwal, AK
    Morse, AW
    SIC MATERIALS AND DEVICES, 1998, 52 : 195 - 236
  • [49] Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging
    Yao, Yiying
    Chen, Zheng
    Lu, Guo-Quan
    Boroyevich, Dushan
    Ngo, Khai D. T.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 2 (04): : 539 - 547
  • [50] High Temperature Electronics for Demanding Aircraft Applications
    Brewer, Roger A.
    2018 INTERNATIONAL APPLIED COMPUTATIONAL ELECTROMAGNETICS SOCIETY SYMPOSIUM (ACES), 2018,