Effect of packing density on Crosstalk in On-chip Optical Interconnects

被引：0

作者：

Agarwalla, Prativa ^{[1
]}

Das, N. R. ^{[2
]}

机构：

[1] Heritage Inst Technol, Kolkata, India

[2] Inst Radio Phys Elect, Kolkata, India

来源：

PHYSICS OF SEMICONDUCTOR DEVICES | 2014年

关键词：

Crosstalk; packing density; optical interconnect; width-to-pitch ratio;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Optical interconnects hold the promise of revolutionizing computing speed having higher bandwidth and lower power consumption. For high packing density of optical interconnects, crosstalk is calculated considering the coupling of fields of two parallel identical neighboring waveguides. The study shows that there exists minimum pitch for a particular length and width of the interconnects to avoid significant amount of crosstalk. Again, an optimum ratio of width-to-pitch exists for which crosstalk is minimum.

引用

页码：823 / 825

页数：3

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