Metallographic Examination of Fire Damages in Electronic Equipment

被引:0
|
作者
Reiter, K. [1 ]
Puls, S. [1 ]
机构
[1] Fraunhofer Inst Siliziumtechnol, Fraunhoferstr 1, D-25524 Itzehoe, Germany
来源
PRAKTISCHE METALLOGRAPHIE-PRACTICAL METALLOGRAPHY | 2017年 / 54卷 / 07期
关键词
4;
D O I
10.3139/147.110451
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Defects in electronic components and defects caused by electronic components are a frequent cause of fire damage. 35 % of examined cases of fire damage are found to be caused by electrical equipment or by the handling of electricity. Fire damage caused by electronic elements and in electronic assemblies may have a multitude of causes. Minor damages occurring during the manufacture of electronic components and assemblies can lead to operational disruptions in electronic devices and to life-threatening situations. In order to reconstruct a fire damage, a complex failure analysis and comprehensive knowledge of the principle of operation of the devices is required. Metallographic target preparation serves to detect and describe faults. Some damage patterns taken from practice are presented and analyzed here.
引用
收藏
页码:433 / 447
页数:15
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